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| DFM300MXS18-A000 DFM300MXS18-A000 Fast Recovery Diode Module Preliminary Information DS5458-1.1 May 2001 FEATURES s Low Reverse Recovery Charge s High Switching Speed s Low Forward Voltage Drop s Isolated Base KEY PARAMETERS VRRM VF (typ) (max) IF (max) IFM 1800V 2.0V 300A 600A APPLICATIONS s Brake Chopper Diode s Boost and Buck Converters s Free-wheel Circuits s Motor Drives s Resonant Converters s Induction Heating s Multi-level Switch Inverters The DFM300MXS18-A000 is a dual 1800 volt, fast recovery diode (FRD) module. Designed for low power loss, the module is suitable for a variety of high voltage applications in motor drives and power conversion. Fast switching times and low reverse recovery losses allow high frequency operation making the device suitable for the latest drive designs employing pwm and high frequency switching. The module incorporates an electrically isolated base plate. Low inductance construction enables circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety. 1 2 3 2 1 3 Fig. 1 Circuit diagram ORDERING INFORMATION Order As: DFM300MXS18-A000 Note: When ordering, please use the complete part number. Outline type code: M (See package details for further information) Fig. 2 Electrical connections - (not to scale) 1/7 www.dynexsemi.com DFM300MXS18-A000 ABSOLUTE MAXIMUM RATINGS Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability. Tcase = 25C unless stated otherwise Symbol VRRM IF IFM I2t Pmax Visol Qpd Parameter Repetitive peak reverse voltage Forward current (per arm) Max. forward current I2t value fuse current rating Maximum power dissipation Isolation voltage Partial discharge Tvj = 125C DC, Tcase = 65C Tcase = 110C, tp = 1ms VR = 0, tp = 10ms, Tvj = 125C Tcase = 25C, Tvj = 125C Commoned terminals to base plate. AC RMS, 1 min, 50Hz IEC1287. V1 = 1500V, V2 = 1100V, 50Hz RMS Test Conditions Max. 1800 300 600 30 1040 4.0 10 Units V A A A2s W kV pC THERMAL AND MECHANICAL RATINGS Internal insulation: Baseplate material: Creepage distance: Clearance: CTI (Critical Tracking Index): Al2O3 Cu 22mm 12mm 175 Test Conditions Continuous dissipation junction to case Rth(c-h) Thermal resistance - case to heatsink (per module) Tj Tstg Junction temperature Storage temperature range Screw torque Mounting - M6 Electrical connections - M6 Mounting torque 5Nm (with mounting grease) -40 125 125 5 5 C C Nm Nm 15 C/kW Min. Typ. - Symbol Rth(j-c) Parameter Thermal resistance - diode (per arm) Max. 96 Units C/kW 2/7 www.dynexsemi.com DFM300MXS18-A000 STATIC ELECTRICAL CHARACTERISTICS - PER ARM Tvj = 25C unless stated otherwise. Symbol IRM VF Parameter Peak reverse current Forward voltage Test Conditions VR = 1800V, Tvj = 125C IF = 300A IF = 300A, Tvj = 125C L Inductance Min. Typ. 2.0 2.0 30 Max. 5 2.3 2.3 Units mA V V nH DYNAMIC ELECTRICAL CHARACTERISTICS Tvj = 25C unless stated otherwise. Symbol Irr Qrr Erec Parameter Peak reverse recovery current Reverse recovery charge Reverse recovery energy Test Conditions IF = 300A, dIF/dt = 2000A/s, VR = 900V Min. Typ. 220 80 60 Max. Units A C mJ Tvj = 125C unless stated otherwise. Symbol Irr Qrr Erec Parameter Peak reverse recovery current Reverse recovery charge Reverse recovery energy Test Conditions IF = 300A, dIF/dt = 2000A/s, VR = 900V Min. Typ. 255 135 90 Max. Units A C mJ 3/7 www.dynexsemi.com DFM300MXS18-A000 TYPICAL CHARACTERISTICS 800 700 Tj = 25C 600 Foward current, IF - (A) 100 Transient thermal impedance, Zth (j-c) - (C/kW ) 500 Tj = 125C 400 300 100 100 0 0 10 0.5 2.0 1.0 1.5 2.5 Foward voltage, VF - (V) 3.0 3.5 1 0.001 1 2 3 4 Ri (C/KW) 2.8086 10.5142 16.6906 66.004 i (ms) 0.006863 1.8477 14.6244 76.68 0.01 0.1 Pulse width, tp - (s) 1 10 Fig. 2 Diode typical forward characteristics Fig. 4 Transient thermal impedance 1500 600 500 Power dissipation, Ptot - (W) DC forward current, IF - (A) 1000 400 300 500 200 100 0 0 20 40 60 80 100 120 Case temperature, Tcase - (C) 140 160 0 0 20 40 60 80 100 120 Case temperature, Tcase - (C) 140 160 Fig. 5 Power dissipation Fig. 6DC current rating vs case temperature 4/7 www.dynexsemi.com DFM300MXS18-A000 400 350 Reverse recovery current, IRR - (A) 300 250 200 150 200 50 Tj = 125C 0 0 400 1200 800 Reverse voltage, VR - (V) 1600 2000 Fig. 7 RBSOA 5/7 www.dynexsemi.com DFM300MXS18-A000 PACKAGE DETAILS For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. 28 0.5 28 0.5 1 62 0.8 48 0.3 2 3 93 0.3 3x M6 31 0.8 23 106 0.8 108 0.8 Nominal weight: 270g Recommeded fixings for mounting: M6 Recommended mounting torque: 5Nm (44lbs.ins) Recommended torque for electrical connections (M6): 5Nm (44lbs.ins) Module outline type code: M 6/7 www.dynexsemi.com DFM300MXS18-A000 POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs). HEATSINKS The Power Assembly group has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer service office. http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. 99 Bank Street, Suite 410, Ottawa, Ontario, Canada, K1P 6B9 Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. (c) Dynex Semiconductor 2001 Publication No. DS5458-1 Issue No. 1.1 May 2001 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRINTED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. 7/7 www.dynexsemi.com |
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